OmniVision Technologies, Inc. (NASDAQ: OVTI), the world’s largest supplier of CMOS image sensors, today launched its OmniBSI™ architecture, a novel sensor design that uses backside illumination (BSI). OmniBSI enables improved image quality on increasingly miniaturized chips.

BSI methodology involves turning the CameraChip™ sensor upside down so that it collects light through what was previously the backside of the sensor, providing the most direct path for light to travel into the pixel. BSI technology affords a much larger aperture size, which allows for lower f stops, facilitating the development of better performing camera modules with superior camera performance.

OmniVision is currently demonstrating an 8 MegaPixel, OmniBSI CameraChip sensor, and expects to start sampling first products before the end of June.